However, the electronic products of display should be withstand
the most stringent environment, especially for the outdoor that all the
materials must withstand high and low
temperature
with heating or shrinkage and long-term UV exposure, wind, sand storm and other
tests.
The
design of both the Cabinet frame and the materials of light plate module which
must comply with these environmental conditions. If it is movable
products which must also obtain easy disassembly and security in the structural
requirements for hanging.
No matter what kind
of style products, the most important thing is the display should be showing
the splendid and real colors. In the long-term use of request, LED chip size
and packaging process must be extremely required to ensure that the light
conditions, that is, the gray value of RGB is consistent with the original. The
color and brightness can not be varied as long-term use.
Synch
LED Display Engineering Co., Ltd. is indicated to use the
chips which are producing in Taiwan
such as the Epistar Corporation, HUGA OPTOTECH, Tekcore Co, .LTD, Genesis Photonics Inc…etc. The size of the chip is required in 14 x
13 mil; the wavelength within 1%; the forward voltage within 0.1V. And all the packaging process is
automatic controlled by the computer. The only thing we required is the spec
and quality which all higher than the normal standard, and then the color of
screen, brightness and visible angle all will keep in the same. The life of LED
display will be longer for the above.
n
High-end large-size chip
packaging process in Taiwan
n
Plastic kit new PC material, does not fade and water resistance
n
Automatic plug-in lamp
n
Taiwan PCB board to
ensure that the 94V0 fire rating
n
Ensure Taiwan’s manufacturing,
complete the test burn-in, excellent weather
resistance
n
Lamp & driver IC board in one side, the plot is not hot, long service life time
|
Classification
|
Real
Module
|
Virtual
Module
|
|
Module Item
|
P10-D04
|
P16-D01
|
P20-D01
|
P25-D01
|
P10-D02V
|
P16-D01V
|
P20-D01V
|
P25-01V
|
|
LED Type
|
DIP 346
|
DIP 546
|
DIP 546
|
DIP 546
|
DIP 346
|
DIP 546
|
DIP 546
|
DIP 546
|
|
Pixel Composition
|
1R1G1B
|
1R1G1B
|
2R1G1B
|
2R1G1B
|
2R1G1B
|
2R1G1B
|
2R1G1B
|
2R1G1B
|
|
Pixel Pitch(mm)
|
10
|
16
|
20
|
25
|
10
|
16
|
20
|
25
|
|
Virtual Pixel Pitch
|
|
|
|
|
5
|
8
|
10
|
12.5
|
|
Module Size(mm)
|
320X160
|
256X128
|
320X160
|
200X200
|
160X160
|
256X128
|
320X160
|
200X200
|
|
Resolution (Pixel)
|
32X16
|
16X8
|
16X8
|
8X8
|
16X16
|
16X8
|
16X8
|
8X8
|
|
Pixel Density / ㎡
|
10,000
|
3,906
|
2,500
|
1,600
|
10,000
|
3,906
|
2,500
|
1,600
|
|
View Angle(@2θ)
|
110°/40°
|
110°/40°
|
110°/40°
|
110°/40°
|
110°/40°
|
110°/40°
|
110°/40°
|
110°/40°
|
|
Brightness
|
>5,000
|
>12,000
|
>9,000
|
>7,000
|
>5,000
|
>10,000
|
>9,000
|
>7,000
|
|
Max Power / ㎡( W)
|
1,800
|
1,000
|
680
|
450
|
1,800
|
1,000
|
680
|
450
|
|
Avg. Power / ㎡ (W)
|
600
|
350
|
230
|
150
|
600
|
350
|
230
|
150
|
|
Driving Method
|
1/4 Scan
|
Static
|
Static
|
Static
|
1/2 Scan
|
Static
|
Static
|
Static
|
|
Viewing Distance /M
|
8
|
12
|
15
|
20
|
8
|
15
|
20
|
25
|
MOQ:1000 PCS
2012/01/02
